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Temp range -45℃~90℃ Temp accuracy ±0.1℃
Multi channel chillers Video
Modelo | FLTZ-203W-2T | |
Pipeline | channel 1 | channel 2 |
Temperatura | -20℃~+90℃ | -20℃~+90℃ |
Capacidad de refrigeración | ±0.1℃(Customizable temperature control accuracy of ±0.01°C.) | |
Potencia calorífica | 4kW@-10℃ | 4kW@-10℃ |
Heat conducting medium flow rate | 2kW | 2kW |
Heat conducting medium connection size | 20L/min 0.5MPa | 20L/min 0.5MPa |
Heat transfer interface | ZG3/4 | ZG3/4 |
Ambient temperature | 10~35℃ | 10~35℃ |
Ambient humidity | 30~70% | 30~70% |
Temperatura del agua de refrigeración | 15~20℃ | 15~20℃ |
Cooling water flow rate | 20 l/min | 20 l/min |
Peso | 400 kg | |
Dimensión cm | 50*90*160 |
Modelo | FLTZ-406W/ETCU-015W | |
Pipeline | channel 1 | channel 2 |
Temperatura | -45℃~+40℃ | +10℃~+80℃ |
Capacidad de refrigeración | ±0.1℃(Customizable temperature control accuracy of ±0.01°C.) | |
Potencia calorífica | 11kW@-20℃ 5kW@-40℃ |
13kW@+10℃ |
Heat conducting medium flow rate | 2kW | 6kW |
Heat conducting medium connection size | 17L/min 0.7MPa | 17L/min 0.7MPa |
Heat transfer interface | ZG3/4 | ZG3/4 |
Ambient temperature | 10~35℃ | 10~35℃ |
Ambient humidity | 30~70% | 30~70% |
Temperatura del agua de refrigeración | 15~20℃ | 15~20℃ |
Cooling water flow rate | 40L/min | 20 l/min |
Peso | 550kg | |
Dimensión cm | 60*100*185 |
Modelo | FLTZ-203W/2T dual system | FLTZ-305W/2T dual system | FLTZ-406W/2T dual system | |||
Temperatura | -20℃~90℃ | -30℃~90℃ | -45℃~90℃ | |||
Precisión del control de temperatura | ±0.1℃(Customizable temperature control accuracy of ±0.01°C.) | |||||
Heat conducting medium flow rate | 15~45l/min 6bar max | |||||
Potencia calorífica | 2,5 kW | 2,5 kW | 2,5 kW | 2,5 kW | 3,5 kW | 3,5 kW |
Capacidad de refrigeración | 3kW @-15℃ | 3kW @-15℃ | 5kW @-15℃ | 5kW @-15℃ | 2.5kW @ -35℃ | 2.5kW @ -35℃ |
Volumen del fluido circulatorio interno | 5L | 5L | 8L | 8L | 8L | 8L |
Interfaz de agua de refrigeración | 50L/min at20℃ | 600L/min at20℃ | 50L/min at20℃ |
Modelo | FLTZ-203W/ETCU-008W | ||
Pipeline | channel 1 | channel 2 | channel 3 |
Temperatura | -10℃~+60℃ | +30℃~+80℃ | -10℃~+80℃ |
Temperature stability | ±0.1℃(Customizable temperature control accuracy of ±0.01°C.) | ||
Capacidad de refrigeración | 4kW@-10℃/21kW@+20℃ | 6 kW@+30℃ | 3kW@-10℃ |
Potencia calorífica | 4kW | 4.5+6kW | 3kW |
Heat conducting medium flow rate | 17L/min 0.7MPa | 17L/min 0.7MPa | 17L/min 0.7MPa |
Heat conducting medium connection size | ZG3/4 | ZG3/4 | ZG3/4 |
Ambient temperature | 10~35 ℃ | 10~35 ℃ | 10~35 ℃ |
Ambient humidity | 30~70% | 30~70% | 30~70% |
Cooling water flow rate | 15~20℃ | 15~20℃ | 15~20℃ |
Temperatura del agua de refrigeración | 30L/min@15~20℃ | 15L/min@15~20℃ | 15L/min@15~20℃ |
Circuit breaker | 100A | ||
Peso | 600kg | ||
Dimensión cm | 60*100*170 |
Modelo | FLT-215W/ETCU-015W/ETCU-008W | ||
Pipeline | channel 1 | channel 2 | channel 3 |
Temperatura | -20℃~+50℃ | +30℃~+100℃ | +30℃~+40℃ |
Temperature stability | ±0.1℃(Customizable temperature control accuracy of ±0.01°C.) | ||
Capacidad de refrigeración | 15kW@-10℃ | 13kW@PCW+15℃ | 8kW@PCW+10℃ |
Potencia calorífica | 2kW | 6kW | Pump Heat Loss |
Heat conducting medium flow rate | 30L/min 0.85MPa | 30L/min 0.85MPa | 20L/min 0.8MPa |
Heat conducting medium connection size | ZG3/4 | ZG3/4 | ZG3/4 |
Ambient temperature | 10~35 ℃ | 10~35 ℃ | 10~35 ℃ |
Ambient humidity | 30~70% | 30~70% | 30~70% |
Cooling water flow rate | 15~20℃ | 15~20℃ | 15~20℃ |
Temperatura del agua de refrigeración | 30L/min@15~20℃ | 15L/min@15~20℃ | 15L/min@15~20℃ |
Circuit breaker | 75A | ||
Peso | 600kg | ||
Dimensión cm | 60*100*170 |
Multi-channel Chiller‘s Applications
FLTZ multi-channel chillers are widely used in the semiconductor industry due to their advantages such as precise temperature control, independent circuit management, and rapid cooling. The application scenarios of semiconductor chillers include wafer manufacturing, packaging testing, photolithography, etching, CVD/PVD deposition, cleaning processes, etc.
The high-energy particle beam generated during ion implantation can cause local high temperatures. The process chiller can quickly remove heat to prevent thermal damage to the wafer.
During plasma etching (RIE, ICP, etc.), the chamber and electrodes need to be strictly temperature controlled to ensure etching uniformity. The chiller can provide a stable temperature environment for etching equipment and reduce process deviations
In the packaging process of BGA, CSP, FCBGA, etc., the temperature control of welding and packaging materials affects reliability
CVD (such as LPCVD, PECVD) and PVD (such as sputtering coating) are used for thin film deposition, and the temperature control of the chamber and substrate affects the quality of the film.
The exposure system, optical lenses, laser light sources, and mask plates of the photolithography machine require precise temperature control to ensure pattern accuracy.
Used to help maintain deionized water within a specific temperature range to remove photoresist residues, metal contamination and particulate matter.
Why do you need FLTZ multi channel chillers?
Por qué elegir LNEYA®?
If LNEYA® multi channel chillers do not meet your application
we can tailor a suitable solution for you.
Contacte con LNEYA®
Envíenos su solicitud y nos pondremos en contacto con usted en 24 horas
WeChat/Teléfono
18914253067
86 13912479193
Dirección de correo electrónico
sales@cnzlj.com