LTS -20℃~80℃ Fluoride cooling and heating system

Temperature control during semiconductor manufacturing

Control del caudal12L/min~45L/min
Internal circulating liquid4L~10L
Depósito de expansión10L~20L
Lugar de origenChina

sistema dinámico de control de la temperatura Control de temperatura de líquidos fluorados Serie LTS enfriador de pruebas de semiconductores

CONSULTA

Descarga de datos del producto

manual.pdf

Parámetros detallados

Modelo	LTS-202	LTS-203	LTS-204	LTS-206	LTS-208
	LTS-202W	LTS-203W	LTS-204W	LTS-206W	LTS-208W
Temperatura	-20℃～35℃
Precisión del control de temperatura	±0.1℃ at -20℃～0℃
Control del caudal	7～25L/min		12～45L/min
	The flow control adopts frequency converter adjustment, and the speed is automatically adjusted according to the feedback signal of the flow sensor. The maximum pressure of the circulating pump is 5bar.
Internal circulating fluid volume	4L	5L	6L	8L	10L
Volumen del depósito de expansión	10L	10L	15L	15L	20L
Visualización de la presión del sistema	The pressure of the refrigeration system is realized by a pointer pressure gauge (high pressure, low pressure)
	The pressure acquisition outlet position of the circulatory system is detected by a pressure sensor and displayed on the touch screen
Controlador	PLC, algoritmo de control PID difuso, con algoritmo de control en cascada
Temperature control	Modo de control de la temperatura de salida del fluido caloportador
	External temperature sensor: (PT100 or 4～20mA or communication setting) control mode (cascade control)
Carta de acuerdo	Interfaz Ethernet Protocolo TCP/IP
	Interfaz RS485 protocolo modbus RTU
Internal temperature feedback of equipment	Equipment heat transfer medium outlet temperature, medium inlet temperature, refrigeration system condensation temperature, ambient temperature, compressor suction temperature, cooling water temperature (available for water-cooled equipment)
Sistema de circulación cerrado	The whole system is a fully enclosed system, low temperature does not absorb moisture in the air, does not volatilize the heat transfer medium, and the low temperature automatically supplements the heat transfer medium into the circulation system
Compresor	Emerson Copeland/Danfoss Scroll Flexible Compressor
Bomba de circulación	Magnetic circulation pump
Evaporador	Intercambiador de placas
Condensador	Micro channel condenser (air-cooled)
	Plate heat exchanger (water-cooled), special attention: clean factory water is required
Accesorios de refrigeración	Danfoss/Emerson accessories (filter drier, oil separator, high and low pressure protector, expansion valve)
Panel de control	LNEYA pantalla táctil en color de 7 pulgadas personalizada, visualización de la curva de temperatura\EXCEL exportación de datos
Seguridad	With self-diagnosis function; phase sequence open-phase protector, refrigerating machine overload protection; high-pressure pressure switch, overload relay, thermal protection device and other security functions.
Tamaño de la interfaz de entrada y salida	ZG1/2	ZG1/2	ZG3/4	ZG3/4	ZG3/4

Descripción del producto

It is widely used in the semiconductor manufacturing process to control the temperature of the reaction chamber, the temperature of the heat sink, and the temperature control of the non-flammable fluid of the heat transfer medium.

1. The pressure holding test of the medium circulation system is 7 bar.
2. Use high-quality magnetic pump without mechanical shaft seal.
Optimizar el muestreo de temperatura y la velocidad de respuesta, algoritmo de control de diseño especial, puede responder rápidamente a un control estable de la temperatura.
4. Enhance the design of the circulating pump capacity to meet the high-lift requirements of the system.
5. Continuous high-temperature cooling technology meets the requirements for stable operation when heat is loaded on the heat sink plate and requires cooling and heating constant temperature control.
6. In view of the volatile characteristics of fluorinated liquid, the joint design and system sealing design are strengthened to ensure the service life of the medium.

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